First, as already teased, let’s look at the large vapor chamber. As expected, pure copper can be found under a thin layer of nickel. However, the tool marks are omnipresent, but do not detract from the functionality.
The thermal pad of the GPU is a TPM 7950 from Honeywell with a thickness of 0.25 mm. However, it is a phase change pad and so the material presses aside very well during the first burn-in, resulting in a really very thin and durable layer from which no more silicone can bleed. The 3:1 composition of aluminum oxide (corundum) and zinc oxide is ideal.
The heatsink for the RAM lies directly on the vapor chamber and is made of nickel-plated aluminum. It can be assumed that the frame and the vapor chamber were already connected before they were nickel-plated together.
The thermal pads of the RAM modules are slightly crumbly and firm, as relatively little silicone oil was bound in the matrix. The lack of carbon is evidence of a rather simple silicone matrix.
After the intended evaporation of the silicone components in the first shot, an interesting picture emerges, as the pad relies predominantly on corundum with somewhat finer zinc oxide as a thickener (“binder”) in the matrix. You can do it like this.
The pads of the voltage converters are somewhat lighter, softer and, above all, a little oilier. Corundum is also used, but without zinc oxide.
The heat sinks of the voltage converters are also made of the familiar nickel-plated aluminum.
The same applies to the many cooling fins, whose material could be clearly determined.
However, the rear pads come from a much deeper drawer, as no other thermally conductive particles are mixed in. The matrix consists of a pure polymer.
The backplate, on the other hand, is a kind of grab bag. Once you have lasered your way through the extremely thick powder coating, you come across an alloy of aluminum, silicon and traces of magnesium. This looks like a so-called wrought alloy and is clearly superior to any normal aluminum plate in terms of its thermal and mechanical stability.
That’s it and yes, XFX has gone to a lot of trouble here, because it could have been much simpler, but then in worse quality.
- 1 - Einführung, technische Daten und Technologie
- 2 - Test Setup
- 3 - Teardown: PCB, Topologie und Komponenten
- 4 - Teardown: Lüftersystem und Kühler
- 5 - Teardown: Material-Analyse
- 6 - Gaming Performance WQHD (2560 x 1440)
- 7 - Gaming Performance Ultra-HD (3840 x 2160)
- 8 - Gaming Performance FSR vs. DLSS
- 9 - Details: Leistungsaufnahme und Lastverteilung
- 10 - Lastspitzen, Kappung und Netzteilempfehlung
- 11 - Temperaturen, Taktraten und Infrarot-Analyse
- 12 - Lüfterkurven und Lautstärke
- 13 - Zusammenfassung und Fazit
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