Teardown: The fans
A total of three 10 cm fans (9.8 cm rotor blade diameter), each with 11 rotor blades, provide the airflow. The closed inner ring of the propeller is interesting, so that less turbulence (and losses) occur at the openings of the fan. XFX deliberately opts for larger 10 cm fans, as the installation height easily allows for this.
More interesting, however, are the details of the fans and the mounting. Let’s start with the plug-in and removable fans, whose magnetic system is an intelligent solution. At least the modules are easier to clean. The fans are made by Dongguan Champion Electronics Technology Co Ltd and have proper double ball bearings. Should one of the fans break, XFX promises an uncomplicated replacement without RMA of the entire card.
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Inserting the fans (and of course removing them) is child’s play. Click and click. Done.
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Teardown: The cooler
The cooler of the XFX Mercury RX 7900 XTX Magnetic Air 24 GB relies on a massive vapor-chamber design. The vapor chamber supports the continuous 6 mm heatpipes made of nickel-plated copper composite. The cooler is secured via the four spring screws on the GPU and seven screws on the backplate. The remaining holes in the PCB are screwed to the backplate from the front. The various heat conducting pads are not oily, but a good average and even quite thin in the case of the RAM. We will see this in the material test on the next page. The vapor chamber is large enough to also cool the RAM. However, this is not done directly, but via an attached aluminum frame. More on this in the material test.
The solid backplate fits into the overall picture of above-average quality and uses thick thermal pads for the GPU and voltage converters. Three additional tapes are supposed to help cool the RAM, but they were stuck to the board. Yes, this is somewhat helpful, but it would have been superfluous, at least for the RAM. With the GPU, the difference between the top of the substrate and the bottom of the board is around 15 Kelvin, so it’s more worthwhile.
Thermal paste and the
XFX finally uses pads instead of running paste, in this case a TPM 7950 from Honeywell. I’ve been using these pads for a long time and have only had the best experiences with them so far. There are also a few more details on this in the material analysis. If you are planning to use the card for water cooling, you should definitely use a fairly viscous thermal paste and not a liquid one after a modification or reassembly following a teardown!
Cleaning is similarly problematic as with the RX-Vega, because the spaces between the graphics die and the 6 chiplets are quite narrow and the interposer underneath is very sensitive to pressure and tension. With a bit of bad luck, it will crack faster than you can say pug. I recommend dry cleaning using cotton buds and applying as little pressure as possible. Only at the end can you do the fine cleaning with a soft cloth and isopropyl alcohol. No matter what you reapply later, no residue should remain in the relevant areas.
- 1 - Einführung, technische Daten und Technologie
- 2 - Test Setup
- 3 - Teardown: PCB, Topologie und Komponenten
- 4 - Teardown: Lüftersystem und Kühler
- 5 - Teardown: Material-Analyse
- 6 - Gaming Performance WQHD (2560 x 1440)
- 7 - Gaming Performance Ultra-HD (3840 x 2160)
- 8 - Gaming Performance FSR vs. DLSS
- 9 - Details: Leistungsaufnahme und Lastverteilung
- 10 - Lastspitzen, Kappung und Netzteilempfehlung
- 11 - Temperaturen, Taktraten und Infrarot-Analyse
- 12 - Lüfterkurven und Lautstärke
- 13 - Zusammenfassung und Fazit
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