Let’s finally get to the benchmarks, starting with the synthetic ones. The A-Die kit enters the race with the DDR5-5600 JEDEC setting and with manual overclocking at DDR5-7466. As a reference, there is also the maximum overclocked G.Skill Trident Z5 kit alongside the other DDR5 kits in the XMP and the DDR4 kit. Normally, we refrain from comparing overrated kits to be fair, since there is always a certain amount of silicon lottery involved. But today we make an exception to put the performance maximum of the older DDR5 SK hynix 16 Gbit M-Die ICs in relation to the new A-Die ICs at their performance maximum.
In the Linpack Xtreme, where a compromise of bandwidth and latency is crucial, the manual A-Die overclock can achieve first place with advantages in both respects. The 5600 Mbps JEDEC config is in the upper midfield despite the relatively lax timings and well ahead of DDR5-4800 JEDEC and the DDR4 comparison config.
The AIDA64 bandwidth tests speak for themselves and the results are effectively analogous to the clock rate.
In the latency test, the A-Die modules are already faster out of the box than many entry-level DDR5 kits and with manual optimization, even the G.Skill kit can be undercut at DDR5-7000 and DDR4.
The A-Die modules are also clearly in first place in the Geekbench 3 Multi-Core Memory Test, but it’s not quite enough for the 15000 point mark. Here, my special modules are probably rather losers in the silicon lottery, because many overclockers can almost easily pass this sound barrier here. The early A-Die modules from SK hynix are virtually “rough diamonds” that have not been binned any further. Those who can buy several kits at once and bin them themselves, or can wait for upcoming XMP SKUs, should then be able to count on a more constant OC potential.
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