Material analysis in detail
Let’s start with the heatsink. This is made of pure electrolytic copper and is quite thinly nickel-plated. You can still see the tool marks quite clearly and they are even less than 2 µm. But that doesn’t really matter, because there is also…
… the thermal paste. Here, however, Palit has reached into the cheapest box in the pre-series, because it is a very simple and quite liquid zinc oxide (ZnO) silicone paste. I don’t know how long it will last, but I had to replace it after disassembly anyway. For mass production, better paste will probably be used.
Now we come to the pads on the memory. They are quite soft, somewhat oily and rely on Al2O3, i.e. aluminum oxide and, of course, silicone as a binder.
The pads on the voltage converters are much better. Silicone is of course used, but there is also Al2O3 and ZnO.
The inner part of the frame, which carries everything, is made of a functional aluminum-silicon alloy.
The anodized backplate of the removable back cover is made of simple anodized aluminum:
That leaves the GPU spring cross. This is made of normal, nickel-plated (< 4 µm) spring steel.
That concludes the analysis part and we finally come to the benchmarks.
- 1 - Intro, technical Data and Unboxing
- 2 - Test System and Equipment
- 3 - Teardown: PCB, Components and Cooler
- 4 - Material Analysis
- 5 - Gaming Performance FHD (1920 x 1080)
- 6 - Gaming-Performance WQHD (2560 x 1440)
- 7 - Gaming Performance Ultra-HD (3840 x 2160)
- 8 - Power Consumption and Load Balancing
- 9 - Transients and PSU Recommendation
- 10 - Clock Rate, Temperatures and Infrared Analysis
- 11 - Fan Curves and Noise
- 12 - Summary and Conclusion
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