Teardown and PCB analysis
So what’s new under the familiar Vengeance heatsink dress? Conveniently, the modules got so warm during the heatsink test and the adhesive pads were correspondingly weak that the heatsink halves were very easy to remove. Relatively thin thermal pads are used to thermally connect the ICs and the PMIC area to the heat sink. The PMIC pad can only touch the coils, but this is sufficient for a mid-range kit with a limited voltage supply. As always, a foam placeholder is used on the back instead of the ICs.
The board with the new memory ICs is particularly interesting. These are labeled “SEC 346K4RAH086VS BCQK”. SEC stands for Samsung Electronics Corporation and BCQK should indicate the binning quality class. The middle part stands for the part number, with the S at the end indicating the die revision. However, to date there is no public data sheet for the ICs and no DDR5 IC with “S” at the end is listed on Samsung’s website. Instead, there is a “P-Die”, which, according to my information, is only installed on RDIMMs so far.
As usual for Richtek, the PMIC has a short cryptic character string “0P=AJ”, which is limited to 1.435 V VDD/VDDQ. The SPD from Rambus is labeled “5118G1B” and lo and behold, this is also the product number according to the website – refreshingly simple!
Finally, the circuit board itself should also be relevant. Here, however, the wheel is not reinvented and it is the same “KO-10290A-5” design by Hsien Jinn that many other Corsair Vengeance non-RGB kits already use. The week of manufacture is stamped “2346”. There is also a layer indicator and it is a 10-layer board.
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