SPD information
As always, the SPD contains the most important information about the sticks. The product or part number can be found here again together with the confirmation from “S-Die”, whereby the SPD hex code also only contains a “19”, which HWinfo translates. At least Corsair has stored the value in the SPD – unfortunately, some manufacturers don’t do this. Our kit was probably produced in week 3 of 2024 and the new serial number is not stored in the SPD.
Here we also find further confirmation that these are 16 Gbit ICs, with x8 bit width, organized in 2 32-bit wide subchannels, all as usual for DDR5 UDIMMs. According to JEDEC, the ICs are binned for DDR5-4800 at primary timings of 40-40-40-77 and 1.1 V, which is unfortunately disappointingly slow for DDR5 ICs of the 2nd and 3rd generation.
As usual, the SPD is a type SPD5118, although the manufacturer “Rambus” is new, at least to me. The PMIC comes from Richtek Power, is of the PMIC5100 type and does not support voltages > 1.435. I still find the term “Overclocking PMIC” in the specifications on Corsair’s website misleading.
The XMP profile is DDR5-6000 with timings tCL 38, tRCD 44, tRP 44, tRAS 96, tRC 140, tWR 90, tRFC1 885, tRFC2 480, tRFC_SB 390 and Command Rate 2N, at 1.35 V VDD/VDDQ, 1.8 V VPP and 1.2 V VDD2. As usual for DDR5, only 1 DIMM per channel is supported, just as the kit is delivered. Simply plugging in a second kit is usually not possible without loss of stability and is therefore not recommended.
Heatsink test
As usual, we continue to test the cooling solution of the RAM modules and how much thermal potential is available for overclocking. Of course, this also implicitly tests whether a kit survives the stress test in XMP mode at all without becoming unstable – yes, that also happens!
With an intensive RAM stress test like Karhu and without a slot gap between the modules, the highest possible thermal load is generated. Together with another temperature sensor on the testbench, the delta to the ambient temperature is determined, once passively cooled and once actively cooled with a 120 mm fan, which is located directly on the modules and blows downwards at 2000 rpm.
Like a CPU, a memory IC can also be relatively energy-efficient or not, depending on the architecture and manufacturing process. Normally, this fact is negligible with a few watts of waste heat per RAM module, but if the heat sink is also designed rather sparingly, it can become relevant. Just under 50 K above the ambient temperature, combined with a moderately ventilated case in the summer, is not far off the maximum operating temperature of 85 °C specified for DDR5 by JEDEC. Although our test kit never became unstable even at just under 90 °C in the XMP profile, a slightly more massive heat sink with more surface area would still ease our conscience.
For the sake of clarity, the manufacturers and product names of the RAM kits have been abbreviated as follows:
- CDPR: Corsair Dominator Platinum RGB
- TGDR: Teamgroup DELTA RGB
- CV: Corsair Vengeance
- CVR: Corsair Vengeance RGB
- GSTZ5R: G.Skill Trident Z5 RGB
- 5H16M: DDR5 Hynix 16 Gbit M-die
- 5H16A: DDR5 Hynix 16 Gbit A-die
- 5M24B: DDR5 Micron 24 Gbit RevB
- 5M16D: DDR5 Micron 16 Gbit RevD
- 5H24M: DDR5 Hynix 24 Gbit M-Die
- 5S16B: DDR5 Samsung 16 Gbit B-Die
- 5S16S: DDR5 Samsung 16 Gbit S-Die
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