Teardown: PCB layout and components
Let’s start with the PCB, which is 1.1 of the Non-Super’s PCB and even has the same revision number. NVVDD is still the most important voltage and this results in a voltage converter design with a total of 8 real phases and the resulting 8 control loops for NVVDD alone. Compared to the RTX 4070 Super FE, there is therefore a slight increase, which seems necessary in view of the significantly higher TDP.
It all looks a bit meagre again, but we have to get through it now. Once again, separate PWM controllers are used for NVVDD (GPU core) and FBVDDQ (memory), as the top models among the PWM controllers are unfortunately far too expensive. Therefore, the good and well-known uP9512R from UPI Semi, which can only generate 8 phases and is significantly cheaper, has to do the job again. A second PWM controller in the form of the small uP9529 is then used to control the two phases for the memory. Both controllers are located on the back of the board. Directly between them is an NCB 45491 for monitoring the four 12V rails (3x Aux and 1x PEG). So there is no difference at all between the Super and Non-Super.
All DrMOS used, including those for the memory, are rather inexpensive products from OnSemi. The NPC302150 with 50A peak current used in all control circuits for NVVDD and FBVDDQ (memory) integrates a MOSFET driver, a high-side MOSFET and low-side MOSFET in a single package. This chip is specifically designed for high current applications such as DC-DC buck power conversion applications. This integrated solution reduces the footprint on the PCB compared to a solution with discrete components. The coils used for NVVDD and the memory have an inductance of 220 nH, the capacitors are in cup form, which is more favorable.
The 12V rails on the 12 4 12VHPWR connector are combined into a single rail directly after the socket, another is connected to the PEG and is only used slightly for NVVDD. The BIOS is in the usual place and the generation of the remaining extra-low voltages is the same as before. So there are no more special features.
Teardown: The cooler
Palit has thankfully only screwed the backplate from the rear, which makes disassembly a little easier.
After just two seals and a few screws, you can remove the plate, which unfortunately does nothing to passively cool the voltage converters.
The rest is then quickly explained. A solid, nickel-plated copper heatsink is used instead of the usual vapor-chamber and a total of six heatpipes (four of which run horizontally). But I’ll refer you to the next page, because this time there will also be a material analysis.
The three fans have a rotor diameter of 9.5 cm and are based on no rotor blades. That explains the principle well enough, as it is still the same cooler.
- 1 - Intro, technical Data and Unboxing
- 2 - Test System and Equipment
- 3 - Teardown: PCB, Components and Cooler
- 4 - Material Analysis
- 5 - Gaming Performance FHD (1920 x 1080)
- 6 - Gaming-Performance WQHD (2560 x 1440)
- 7 - Gaming Performance Ultra-HD (3840 x 2160)
- 8 - Power Consumption and Load Balancing
- 9 - Transients and PSU Recommendation
- 10 - Clock Rate, Temperatures and Infrared Analysis
- 11 - Fan Curves and Noise
- 12 - Summary and Conclusion
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