Teardown: The cooler
Disassembling the Radeon Pro W7700 is simple. AMD relies on a “floating” vapor chamber made of pure copper, which supports the actual cooler and is attached to the board by means of a clamping cross. The chamber cooler is supplied directly with air by the radial fan. Its cooling channels are closed except for the inlet and outlet and the exhaust air is directed towards the slot bracket without any losses or detours. The vapor chamber cools the GPU and the memory, while the voltage converters are cooled via the solid aluminum body. There is no backplate.
The Vapor-Chamber for GPU and RAM
The biggest problem is the flatness of the heat sink. The manufacturer has paid better attention this time, as the surface is relatively flat, but not polished (see picture above). The graphite in the heat sink pad came to my mind because it didn’t stick to the cooler like the older graphite pads and still picked up the structure of the heat sink surface after the burn-in. The vapor chamber is made of pure electrolytic copper and we can also see the material traces very clearly in the 300x resolution.
The package with the chip, on the other hand, is almost flawless and much smoother than that of the large Ada card from NVIDIA. You have to praise that, so chapeau, especially as the height dimensions have also been well maintained.
The surrounding heatsink, which cools the memory modules, is made of an interesting aluminum-silicon alloy. Here, too, we first encounter a layer of paint and only then the alloy. This alloy combines the lightness of aluminum with the improved strength and hardness resulting from the addition of silicon. This combination results in a material that is both light and strong, making it ideal for applications where weight reduction without compromising on strength is important. Another key advantage of this alloy is its excellent castability. The flow properties of aluminum-silicon alloys enable the production of complex and detailed shapes, which is of great benefit in many manufacturing processes. This makes them particularly attractive.
The thermal conductivity of these alloys is also an important factor. They dissipate heat efficiently, making them useful for applications such as heat sinks and other heat dissipation components in electronic devices. In addition, the machinability of aluminum-silicon alloys is an advantage that should not be underestimated. They are relatively easy to machine, which reduces manufacturing costs and increases production efficiency. This is particularly advantageous in mass production, where processing time and costs play a significant role.
The thermal connection of the memory and the voltage converters is made via very soft heat conducting pads, which also do not contain too much silicone and therefore make a very good impression. Aluminum oxide, zinc oxide and silicone, that’s all there is to it. You can leave it as it is.
Clamping cross
What is so interesting about the tensioning cross? It’s the surface coating! Because normal steel is followed by a thicker layer of galvanized copper, which is only lightly nickel-plated on the surface.
We can now close this chapter and move on to the benchmarks.
17 Antworten
Kommentar
Lade neue Kommentare
Urgestein
Veteran
Urgestein
Urgestein
Urgestein
Urgestein
Urgestein
Veteran
Urgestein
Mitglied
Urgestein
1
Urgestein
Veteran
Urgestein
Alle Kommentare lesen unter igor´sLAB Community →