Comparison, summary and conclusion
And because you’ve been so good up to this point, here’s a direct comparison of the two time-lapse videos. Now we also see the much slower heating of the board and the connector, as well as the huge temperature differences! Mama mia…
Yes, it’s definitely worth it and I’m glad I made the effort again. And to end the day, there is still a cooling free on the house:
In general, it can be said that for power dissipations up to 450 watts, there should be no thermal hazard to the 12VHPWR connection from the PCB. But in any case, it is incomprehensible why a card with up to 600 watts TDP is offered and then such thermal shortcomings as the input area are overlooked or simply tolerated. Every superfluous degree that thus migrates from the board into the connector, and it does, is exactly one too many.
You may call me a nitpicker or suspect unreflective scaremongering, but it is simply in the current forum an unnecessary thermal load that would be really easy to eliminate and from RMA’s point of view also better to solve it differently. And you also have to ask the cooler manufacturers why they don’t test something like this themselves. The design map for the first 600-Watt test versions (still with the GA 102 and special BIOS) already explicitly showed these places. Eyes closed and through? No, better pad on it and ready!
If you don’t want to rely on Confucius alone, you can stick a piece of pad under the backplate and sleep a bit better next to your sweating PC. Because even the small connector under the shunt (I still don’t believe it) will surely thank you with longevity in the long run. These are simply things that don’t have to be that way. That’s exactly why the good Lord created the thermal pads on the eighth day. 😀
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