Now let’s move on to the G-M2HS03-F Weighing a whopping 105 grams, the cooler does away with the fin block and instead cools with two massive strand blocks. The two 5-mm heat pipes connect the lower block, which acts as a heatsink, to the upper one and the fan placed at the end is then allowed to blow through this kind of tunnel. At 87 mm measured length, it doesn’t really tower over the SSD in length, and the width isn’t much bigger than the SSD itself at 25 mm.
The height of 37 mm for the mounted cooler including SSD is not quite as lush, but you really have to be careful not to collide with the graphics card or other expansions here as well. Measuring beforehand does not hurt with the G-M2HS03-F either.
The accessories are just as generous as in the G-M2HP04-F, because you not only get the cooler including the U-frame for SSD mounting, but also a small screwdriver for the four included mounting screws. In addition, there are again the quite good thermal pads with 0.5 mm (heatsink) and 1 mm thickness (U-frame) in duplicate, as well as a small paper booklet and the screw for the M.2 slot. That is sufficient, but we have already had that.
The 25 mm fan (10 mm thick) is also PWM-controlled and has the usual 4-pin connector on an approx. 50 cm long cable. Connecting it directly to 12 volts again provokes the maximum speeds of over 8500 rpm, which is not only annoying, but completely unnecessary. Below approx. 5000 rpm you don’t hear it at all and from approx. 5600 rpm an increase in rpm doesn’t bring any temperature improvements either! That’s exactly why I also run it regulated via the mainboard (UEFI) at the fixed 5600 rpm. Fits.
The ground 4 mm heatpipes made of copper composite material are perfectly pressed into the blackened heatsink made of extruded aluminum profile and then do exactly what they are supposed to do. This is not witchcraft and does not work badly in practice either, as we will see in a moment. The G-M2HS03-F also has nothing to complain about in terms of workmanship, and we can now really start to test it.
The assembly of the G-M2HS03-F is also done quickly and the pads stick again as needed. As always, the selected hardness is optimal, which also takes some of the pressure off the NAND modules soldered without underfill here. Mounted and tested, let’s go!
G-M2HS03-F - EN
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