In the SPD, which we read out with the Thaiphoon Burner tool, we find BLM16G44C19U4BL next to the product name and the part number of individual modules .M8FB, also the definite confirmation that it is a single-rank topology and 8 memory chips a 16 Gbit are installed to reach the 16 GB capacity each. The PCB layout is allegedly A2, which might not be correct due to the memory chip sizes, but more about that in the teardown.
The XMP profile is specified as 2198 MHz, tCL 19, tRCD 19, tRP 19, tRAS 46, tRC 71, tFAW 47, tRRDS 7 and tRRDL 11 at 1.4 V. This puts the effective theoretical tRCD latency at 8.63 ns, which is almost on par with good Samsung B-Die bins. When you consider that Mircon’s RevB IC’s also have twice the capacity, that’s quite a feat.
Finally, the SPD lists a temperature sensor, a Giantec GT34TS04 to be exact. After a short search of the datasheet it turns out that this chip also integrates the SPD EPROM, the non-volatile memory from which we just read the SPD information. Temperature-related instability is present in almost all DDR4 memory chips, so it’s especially commendable in a high-end product like this that Crucial’s design has been given such a sensor. Especially when overclocking with voltages above the XMP specification, this can become incredibly useful.
The complete SPD export is also linked here again as a large JPG for scrolling through – open in a new tab and zoom in, please. 😉
Now we come to the temperature test, because such large memory chips with relatively high operating voltages must of course also be able to be cooled reliably, otherwise the instabilities just mentioned can occur. We use the test mem v0.12 with the profile “Extreme1@Anta777” as stress test for this because of its very high thermal load.
Tested once with the modules directly next to each other and also with a slot distance, both once without active airflow and today new also in each case with a fan directly on the modules. This may sound unrealistic for most users, but users who place value on maximum performance with RAM do not rely so rarely on active cooling. However, the waste heat from DDR4 is comparatively low, so really only a slight breeze with low audio cost is enough to prevent heat buildup.
As already feared, the modules installed directly next to each other become relatively warm relatively quickly. Remedy is active airflow or a slot distance, if the respective motherboard allows it. Either way, however, the modules ran stably with the XMP profile active and also passed the full stress test, which lasted over two hours, without error. Actually not surprising, because DDR4 is usually specified up to 85° C, which we are still far away from here even with the air temperature in a potential case.
- 1 - Unboxing and first Impressions
- 2 - Dimensions and RGB
- 3 - SPD and Heatsink Performance
- 4 - Teardown and PCB Comparison (vs. RevE)
- 5 - Test Systems and Methods
- 6 - XMP Behavior and Overclocking
- 7 - Synthetic Benchmarks – AIDA64 und Geekbench 3
- 8 - Gaming – Cyberpunk 2077 in UHD, QHD, FHD
- 9 - Summary and Coinclusion
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