Ryzen has been known to be a gluey matter since Zen 2, though not in a conventional way. AMD has been combining CCX chiplets with IO chiplets into one CPU since the Ryzen 3000 series and the glue is the package in the form of copper and fiberglass. Today, we are seperating the glued components of two such CPUs and glueing them back together to [...]
Tuxedo is working on a new Linux laptop with Qualcomm Snapdragon X processor
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